Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers

ABSTRACT

Electronic devices, and methods of manufacturing the electronic devices, utilizing direct die soldering of GaAs integrated circuit dies. In some embodiments, the GaAs integrated circuit die can have a footprint approximately the same size as a die attach pad. Further, the GaAs integrated circuit die can self-align with the die attach pad after reflow of any solder layer used to attach the die.

INCORPORATION BY REFERENCE TO ANY PRIORITY APPLICATIONS

Any and all applications for which a foreign or domestic priority claimis identified in the Application Data Sheet as filed with the presentapplication are hereby incorporated by reference under 37 CFR 1.57.

BACKGROUND OF THE INVENTION

Field of the Invention

The present disclosure generally relates to the field of semiconductorwafer processing technology. In particular, this disclosure relates tothe design, fabrication, and manufacture of gallium arsenide (GaAs)integrated circuits.

Description of the Related Art

The use of GaAs substrates in the design and construction of integratedcircuits has proven to have desirable effects. For example, GaAssubstrates have been useful in achieving greater performance in poweramplifier circuits. Typically, a GaAs integrated circuit will be used asa component in a larger circuit device or design. In order to beintegrated into the circuit design, the GaAs integrated circuit ismechanically and electrically coupled to a printed circuit board for thecircuit device. In other cases, the GaAs integrated device is mounted toother electronic devices.

Current processes for mounting a GaAs integrated circuit to a printedcircuit board typically involves attaching a singulated GaAs die to acontact pad formed on the printed circuit board. The GaAs integratedcircuit usually includes a gold contact layer which is adapted to couplewith a die attach pad on the printed circuit board. Depositing the goldlayer is a time-consuming and relatively inefficient process. Also, goldis an expensive material, increasing the cost for GaAs integratedcircuit products. Finally, gold has a relatively high dissolution ratein solder, and therefore is not able to be soldered to the die attachpad of the device's printed circuit board. As such, the contact side ofthe GaAs integrated circuit is typically adhered to the die attach padusing a conductive adhesive, such as epoxy or solder paste. The use ofconductive adhesive requires an additional manufacturing step, and alsorequires the use of larger pads to accommodate adhesive overflow. Thisrequirement of excess dimensions limits the ability to furtherminiaturize components. However, even with these undesirable features,gold contact layer and conductive adhesive continue to be the standardmaterial and procedure used for attaching GaAs integrated circuit diesto a substrate.

With increasing pressure to reduce the size of components in electronicdevices, there is a need for reducing the required size of the dieattach pad on a printed circuit board or other substrate. There is alsoa need for improved GaAs integrated circuits that employ less costlycomponent materials and can be more efficiently manufactured.Furthermore, there is a need for improved processes and methods formanufacturing such GaAs integrated circuits.

Disclosed herein are embodiments of an electronic circuit devicecomprising a substrate, a die attach pad located on the substrate, and aGaAs integrated circuit die having a copper backside contact pad andhaving a footprint of approximately the same size as the die attach pad,the GaAs integrated circuit die being connected to the die attach pad bya solder layer, the solder layer being disposed between the copperbackside contact pad and the die attach pad on the substrate in a mannersuch that the GaAs integrated circuit die self-aligns with the dieattach pad after reflow of the solder layer.

In some embodiments, the electronic circuit can further comprise abarrier layer, said barrier layer being disposed between said copperbackside contact pad and said solder layer. In some embodiments, saidsubstrate can be a printed circuit board. In some embodiments, saidsolder barrier layer can comprise nickel. In some embodiments, saidsolder barrier layer can further comprise a palladium flash layer.

In some embodiments, thermal resistance of the solder layer can be atleast 40% lower than thermal resistance of an epoxy layer. In someembodiments, the copper backside contact pad can have a thermalconductivity of approximately 4 W/cmK.

Also disclosed herein are embodiments of a GaAs integrated circuitincorporating the electronic circuit device described herein.

Disclosed herein are embodiments of a method for manufacturing a GaAswafer assembly, said method comprising fabricating a GaAs wafer having acopper layer over a backside of the wafer, electroless plating a barrierlayer over said copper layer, forming at least one singulated die fromsaid GaAs wafer, and direct die soldering said at least one singulateddie to a die attach pad on a substrate such that a solder layer isformed between the at least one singulated die and the die attach pad,the soldering performed in a manner such that the at least onesingulated die self-aligns with the die attach pad after reflow of thesolder layer.

In some embodiments, the method can further comprise forming a palladiumflash layer over the copper layer. In some embodiments, said substratecan be a printed circuit board. In some embodiments, a surface area ofsaid singulated die can be substantially equivalent to a surface area ofsaid die attach pad.

Also disclosed herein are embodiments of a GaAs integrated circuit madein accordance with the method disclosed herein. In some embodiments,said GaAs integrated circuit can comprise through-wafer via at leastpartially filled with copper. In some embodiments, the electrolessplating can cover more than 40% of the through-wafer via.

Also disclosed herein are embodiments of an electronic circuit modulecomprising a singulated GaAs integrated circuit die having a coppercontact pad, a printed circuit board having a die attach pad, said dieattach pad sized to receive the singulated GaAs integrated circuit dieand having a footprint of approximately the same size as the singulatedGaAs integrated circuit die, and a solder layer disposed between saidcopper contact pad of the die and said die attach pad of the printedcircuit board, said copper contact pad of the singulated GaAs integratedcircuit die attached to said die attach pad of the printed circuit boardin a manner such that the singulated GaAs integrated circuit dieself-aligns with the die attach pad after reflow of the solder layer.

In some embodiments, the module can further comprise a nickel layer,said nickel layer formed between said copper contact pad and said solderlayer. In some embodiments, the module can further comprise a flashpalladium layer, said flash palladium layer formed between said nickellayer and said copper contact pad and configured to act as a wettinglayer for the solder layer. In some embodiments, the size of said dieattach pad may not exceed the size of said singulated GaAs integratedcircuit die by more than 150 microns in at least one direction. In someembodiments, said singulated GaAs integrated circuit die can be a radiofrequency integrated circuit die.

SUMMARY OF THE INVENTION

Systems and methods for reducing the required size of die attach padsadapted to receive GaAs integrated circuit dies on printed circuitboards and other substrates are disclosed herein. The systems andmethods are designed to effectively attach a singulated GaAs integratedcircuit die to a die attach pad on a substrate, such as a printedcircuit board, without using a conductive adhesive. The direct dieattach systems and methods disclosed herein eliminate the need to uselarger die attach pads to accommodate adhesive overflow and the like.

In one embodiment, an electronic circuit device incorporating a directdie attach system is provided. The device includes a GaAs integratedcircuit die having a copper backside contact pad, a substrate having adie attach pad, and a solder layer. The solder layer is preferablydisposed between the copper backside contact pad on the GaAs integratedcircuit and the die attach pad on the substrate in a manner such thatthe solder layer attaches the integrated circuit die to the substrate.In one implementation, the device further includes a solder barrierlayer that is disposed between the copper backside contact pad and thesolder layer. The solder barrier layer may include nickel and/or apalladium flash layer. In some implementations, the barrier layer mayhave low electrical resistance and low stress. In anotherimplementation, the copper backside contact pad is substantially thesame size as the die attach pad. The substrate can be a printed circuitboard or the like.

In another embodiment, a method for manufacturing a GaAs wafer assemblyis disclosed. The method includes providing a GaAs wafer having a copperlayer over the backside of the wafer. Next, a solder barrier layer isformed over the copper layer. A singulated die from the wafer issoldered to a die attach pad on a substrate. In some embodiments,forming the solder barrier layer comprises forming a nickel layer overthe copper layer. In some embodiments, the method further includesforming a palladium flash over the copper layer. In some embodiments,the substrate can be a printed circuit board. In some embodiments, thesurface area of the singulated die can be substantially equivalent tothe surface area of the die attach pad.

Semiconductor integrated circuits can be made in accordance with themethods disclosed herein. In some embodiments, the integrated circuit isincorporated in a wireless telecommunication device. In someembodiments, the integrated circuit comprises a copper filled throughwafer via, or a through-wafer via at least partially filled with copper.In some embodiments, the integrated circuit comprises a copper contactpad.

In yet another embodiment, an electronic circuit module incorporating adirect die attachment assembly is disclosed. The electronic circuitmodule includes a singulated GaAs integrated circuit having a coppercontact pad, a printed circuit board having a die attach pad, and asolder layer. The die attach pad is sized to receive the singulated GaAsintegrated circuit die. In one implementation, the copper contact pad isattached to the singulated GaAs integrated circuit die by the solderlayer. In another implementation, the size of the die attach pad doesnot exceed the size of the singulated GaAs integrated circuit die bymore than 150 microns in at least one direction.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 shows an example of attaching a singulated GaAs die to a dieattach pad on a substrate.

FIGS. 2A-2B show an example sequence of attaching a GaAs die to asubstrate using standard processes.

FIGS. 3A-3B show an example sequence of attaching a GaAs die to asubstrate using a direct die solder process.

FIG. 4 shows an example sequence of wafer processing for formingsingulated GaAs dies for attachment to a substrate.

FIGS. 5A-5R show examples of structures at various stages of theprocessing sequence of FIG. 4.

FIG. 6 is a block diagram representing the copper metallization processaccording to various aspects of the present invention.

FIGS. 7A-7D show examples of structures at various stages of theprocessing sequence of FIG. 6.

FIG. 8 is a schematic drawing of solder die attach of GaAs diesaccording to one embodiment

FIG. 9A is a cross-sectional view of a GaAs die with solder die attachaccording to one embodiment. FIG. 9B is a cross-sectional view of a GaAsdie with epoxy die attach.

FIG. 10 shows a comparison of maximum operating temperatures betweensolder die attach according to one embodiment and epoxy die attach.

FIG. 11 shows a comparison of thermal resistance between solder dieattach according to one embodiment and epoxy die attach.

FIG. 12 shows failure of a traditional GaAs device with conventional NiVbarrier layer and gold finish due to Cu—Sn intermetallic compoundformation.

FIG. 13 is a block diagram representing the direct die solder processaccording to various aspects of the present invention.

FIGS. 14A-14C show examples of structures at various stages of theprocessing sequence of FIG. 13.

FIG. 15 shows an electrical comparison between solder die attachaccording to one embodiment and an epoxy die attach.

FIG. 16 shows a cross-section of a Ni-plated through wafer via.

FIG. 17 shows a cross-section of a Ni-plated through wafer via.

FIGS. 18A-18D show an example sequence of singulating a GaAs integratedcircuit die from a wafer.

FIG. 19 shows an example sequence of ball grid array packaging ofsingulated GaAs integrated circuit dies, according to one embodiment.

FIGS. 20A-20H show examples of structures at various stages of theprocessing sequence of FIG. 19.

FIG. 21 shows an example shows an example sequence of land grid arraypackaging of singulated GaAs integrated circuit dies, according to oneembodiment.

FIGS. 22A-22G show examples of structures at various stages of theprocessing sequence of FIG. 21.

FIG. 23 shows an example shows an example sequence of leadframepackaging of singulated GaAs integrated circuit dies, according to oneembodiment.

FIGS. 24A-24D show examples of structures at various stages of theprocessing sequence of FIG. 23, according to one embodiment.

FIGS. 25A-25E show examples of structures at various stages of theprocessing sequence of FIG. 23, according to another embodiment.

FIG. 26 illustrates a GaAs integrated circuit device made according tovarious methods of the present invention, mounted onto a printed circuitboard.

FIG. 27 illustrates an electronic device incorporating a GaAs integratedcircuit device made according to various methods of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

Various embodiments of the present disclosure relate to novel methodsand systems for attaching a singulated GaAs die to a substrate such as aprinted circuit board. In some embodiments, an electroless Ni processcan be used for GaAs dies, such as those used in power amplifierfabrication. The Ni can act as a barrier between Cu backsidemetallization for GaAs through wafer via process and the solder dieattach material. Ni thickness can be optimized to adequately serve as abarrier to prevent intermixing of Cu and Sn and thus intermetalliccompound formation, while at the same time not adding too much stress tocause wafer warpage. The minimized Ni thickness also reduces thepossibility that the added magnetic property of plated Ni would impactthe functionalities of the GaAs devices for RF applications.

Before being shipped to a customer, semiconductor dies can be fullytested, singulated from a wafer, and packaged. Unlike in the siliconindustry, in which wafer level packaging is the norm, in compoundsemiconductor industry, particularly GaAs power amplifier manufacturing,die attachment is still in the mainstream of every fabrication. Dieattachment is a process to pick a die from a diced wafer and attach itonto, for example, a lead frame or into a package. A GaAs die istypically attached to a die attach pad by conductive epoxy or solderpaste. However, there are serious disadvantages to the use of epoxy orsolder paste.

Compared to epoxy die attach, direct die solder (“DDS”) of GaAs diesonto frames can have many advantages. For example, solder offers higherelectrical and thermal conductivities, which can be advantageous forhigh power applications. Further, solder offers higher bonding strength,less die tilting, and less die rotation during die attach process.

Additionally, with direct die solder, the typical “runaway” area forepoxy die attach can be eliminated to reduce the size of the package. Ina typical assembly process using epoxy die attach, surface mounts arepicked and placed separately and soldered on the lead frame. A GaAs dieis then picked and placed next and attached by epoxy, which goes througha curing process instead reflow. Using direct die solder, both surfacemounts and the GaAs die can be soldered together during the same reflowprocess. This can be advantageous for meeting the demands of increasedlevel of integration, reduced package size, and higher volume productionin compound semiconductor industry in recent years.

As described in greater detail below, the methods and systems involvedirectly attaching a singulated GaAs die 101 to a die attach pad 102 ona substrate 103 as shown in FIG. 1 without using conductive adhesivesuch as epoxy. The elimination of adhesive significantly reduces theneed for forming a die attach pad with larger dimensions than thesingulated die. In some embodiments, the die attach pad can beidentically sized to the singulated die. The novel die attach methodsand systems described herein reduce the footprint of the mounted die,thereby facilitating further module size reduction.

FIGS. 2A-2B show an example sequence of attaching a GaAs die to asubstrate using standard processes that incorporate the use of aconductive adhesive to attach the die to the substrate. As illustrated,a singulated GaAs die 201 is arranged to be attached to a substrate 205by die attach pad 207 via a conductive adhesive such as epoxy. Thesubstrate 205 is preferably a printed circuit board for an electronicdevice. Typically, the dimensions of the die attach pad 207 exceed thedimensions of the die 201 itself, in order to allow room for adhesive tospread laterally. The larger dimensions of the die attach pad 207effectively expand the footprint of the device, and hinder effortstoward increased miniaturization.

FIGS. 3A-3B show an example sequence of attaching a GaAs die to asubstrate using a direct die attach method in accordance with variouspreferred embodiments of the present invention. In contrast to thesequence illustrated in FIGS. 2A-2B, the die attach pad 307 has the samewidth as the singulated die 301. This can be achieved by the use ofdirect die solder (DDS), as opposed to epoxy. Since solder is less proneto lateral flow during the attachment process, the die attach pad 307can have the same footprint as the singulated die 301. Thisadvantageously reduces the footprint of the device, and allows forreduced component sizes. Further, soldering offers higher bond strength,less die tilting, and less die rotation during a die attach process.However, it is impractical to implement the sequence illustrated inFIGS. 3A-3B for conventional GaAs integrated circuits having a goldcontact layer because of the difficulties in soldering gold due togold's relative high dissolution rate in solder. Accordingly, in certainpreferred embodiments described in greater detail below, the inventorshave developed methods and systems for replacing gold with copper asbackside contact for GaAs integrated circuits in order to implement thedirect die attach methods described herein.

Provided herein are various methodologies and devices for processingGaAs wafers to form GaAs integrated circuits that are subsequentlymounted to printed circuit boards or other devices using a direct dieattach process.

In the description herein, various examples are described in the contextof GaAs substrate wafers. It will be understood, however, that some orall of the features of the present disclosure can be implemented inprocessing of other types of semiconductor wafers. Further, some of thefeatures can also be applied to situations involving non-semiconductorwafers.

FIG. 4 shows an example of a process 10 where a functional GaAs wafer isprocessed to form GaAs integrated circuit dies and the formed integratedcircuit dies are singulated for assembly, which includes direct dieattachment to a printed circuit board or other device without using aconductive adhesive.

In the process 10 of FIG. 4, a functional wafer is provided (block 11).FIG. 5A depicts a side view of such a wafer 30 having first and secondsides. The first side can be a front side, and the second side a backside. FIG. 5B depicts an enlarged view of a portion 31 of the wafer 30.The wafer 30 can include a substrate layer 32 (e.g., a GaAs substratelayer). The wafer 30 can further include a number of features formed onor in its front side. In the example shown, a transistor 33 and a metalpad 35 are depicted as being formed the front side. The exampletransistor 33 is depicted as having an emitter 34 b, bases 34 a, 34 c,and a collector 34 d. Although not shown, the circuitry can also includeformed passive components such as inductors, capacitors, and source,gate and drain for incorporation of planar field effect transistors(FETs) with heterojunction bipolar transistors (HBTs). Such structurescan be formed by various processes performed on epitaxial layers thathave been deposited on the substrate layer.

Referring to the process 10 of FIG. 4, the functional wafer of block 11can be tested (block 12) in a number of ways prior to bonding. Such apre-bonding test can include, for example, DC and RF tests associatedwith process control parameters. Upon such testing, the wafer can bebonded to a carrier (block 13). FIG. 4C shows an example assembly of thewafer 30 and a carrier 40 (above the wafer) that can result from thebonding step 13.

Referring to the process 10 of FIG. 4, the wafer—now mounted to thecarrier plate—can be thinned so as to yield a desired substratethickness in blocks 14 and 15.

Referring to the process 10 of FIG. 4, the thinned and stress-relievedwafer can undergo a through-wafer via formation process (block 16).FIGS. 5D-5F show different stages during the formation of a via 44. Sucha via is described herein as being formed from the back side of thesubstrate 32 and extending through the substrate 32 so as to end at theexample metal pad 35. It will be understood that one or more featuresdescribed herein can also be implemented for other deep features thatmay not necessarily extend all the way through the substrate. Moreover,other features (whether or not they extend through the wafer) can beformed for purposes other than providing a pathway to a metal feature onthe front side.

Referring to the process 10 of FIG. 4, a metal layer can be formed onthe back surface of the substrate 32 in block 17. FIGS. 5G and 5H showexamples of adhesion/seed layers and a thicker metal layer.

FIG. 5G shows that in certain implementations, an adhesion layer 45 suchas a nickel vanadium (NiV) layer can be formed on surfaces of thesubstrate's back side and the via 44 by, for example, sputtering. FIG.5G also shows that a seed layer 46 such as a thin gold layer can beformed on the adhesion layer 45 by, for example, sputtering. Such a seedlayer facilitates formation of a thick metal layer 47 such as a thickgold layer shown in FIG. 5H. In certain implementations, the thick goldlayer can be formed by a plating technique.

The metal layer formed in the foregoing manner forms a back side metalplane that is electrically connected to the metal pad 35 on the frontside. Such a connection can provide a robust electrical reference (e.g.,ground potential) for the metal pad 35. Such a connection can alsoprovide an efficient pathway for conduction of heat between the backside metal plane and the metal pad 35.

Referring to the process 10 of FIG. 3, the wafer having a metal layerformed on its back side can undergo a street formation process (block18). FIGS. 5I-5K show different stages during the formation of a street50. Such a street is described herein as being formed from the back sideof the wafer and extending through the metal layer 52 to facilitatesubsequent singulation of dies.

To form a street 50 (FIG. 5J) through the metal layer 52, techniquessuch as wet etching (with chemistry such as potassium iodide) can beutilized. FIG. 5K shows the formed street 50, with the resist layer 48removed. In the example back-side wafer process described in referenceto FIGS. 4 and 5, the street (50) formation and removal of the resist(48) yields a wafer that no longer needs to be mounted to a carrierplate. Thus, referring to the process 10 of FIG. 4, the wafer isdebonded or separated from the carrier plate in block 19. FIGS. 5L-5Nshow different stages of the separation and cleaning of the wafer 30.

Referring to the process 10 of FIG. 4, the debonded wafer of block 19can be tested (block 20) in a number of ways prior to singulation.

Referring to the process 10 of FIG. 4, the tested wafer can be cut toyield a number of dies (block 21). In certain implementations, at leastsome of the streets (50) formed in block 18 can facilitate the cuttingprocess. FIG. 50 shows cuts 61 being made along the streets 50 so as toseparate an array of dies 60 into individual dies. Such a cuttingprocess can be achieved by, for example, a diamond scribe and rollerbreak, saw or a laser.

In the context of laser cutting, FIG. 5P shows an effect on the edges ofadjacent dies 60 cut by a laser. As the laser makes the cut 61, a roughedge feature 62 (commonly referred to as recast) typically forms.Presence of such a recast can increase the likelihood of formation of acrack therein and propagating into the functional part of thecorresponding die.

Thus, referring to the process 10 in FIG. 4, a recast etch process usingacid and/or base chemistry (e.g., similar to the examples described inreference to block 15) can be performed in block 22. Such etching of therecast feature 62 and defects formed by the recast, increases the diestrength and reduces the likelihood of die crack failures (FIG. 5Q).

Referring to the process 10 of FIG. 4, the recast etched dies (FIG. 5R)can be further inspected and subsequently attached to a printed circuitboard or other substrate. In certain embodiments, the singulated dies 60are preferably directly attached to a contact pad on a printed circuitboard using solder. Since it is difficult to solder gold, the inventorshave developed methodologies to use copper, instead of gold, as backsidecontact for GaAs integrated circuits in conjunction with the direct diesolder approach in attaching the singulated dies to a substrate.

Copper Metallization

GaAs wafers can undergo a backside processing before packaging,including wafer thinning, via formation, and metallization. Backsidemetallization not only provides an electrical ground plane, but alsofunctions as a heat sink to GaAs devices on the front side of the wafer.

While metallization of backside contact of GaAs integrated circuits istypically performed using gold, other integrated circuit technologies,such as silicon-based technologies, use copper (Cu) for a contact layer.Cu has superior conductivity, may be applied more uniformly, and is lesscostly than gold. Further, Cu has a sufficiently low dissolution rate insolder, so allows the integrated circuit device to be soldered to itsprinted circuit board pad. Cu, however, readily oxidizes, which degradeselectrical and mechanical characteristics. Accordingly, when used insilicon processes, the Cu is typically applied in thick layers,polished, and then capped with dielectric materials such as siliconnitride to avoid these oxidation effects.

Although Cu has been used successfully in silicon wafer technology, tothe best of the inventors' knowledge, Cu has not been successfully usedin GaAs integrated circuit devices. A number of obstacles have hinderedthe effective use of copper in metallization of GaAs devices. Forexample, Cu is an unintentional source of impurity, and is often provento be the leading cause of GaAs device failures. Cu rapidly diffusesinto GaAs substrates, at a rate faster than the diffusion of gold intoGaAs substrates, and faster than the diffusion of Cu into siliconsubstrates. Once Cu diffuses into source/gate/drain region of a fieldeffect transistor (FET) or active areas of a heterojunction bipolartransistor (HBT), the device will degrade, and eventually failelectrically. Unlike gold, Cu can diffuse into GaAs and create deepenergy levels in the GaAs band gap region. These deep levels will trapcharges, which lead to degradation and failure of the GaAs devices.

Without wishing to be bound by theory, the inventors have determinedthat there are three mechanisms of Cu diffusion in GaAs. The first isbulk or lattice diffusion, which involves vacancies in the GaAs latticeand the exchange of Cu atoms between layers in the GaAs lattice. Bulkdiffusion is highly temperature dependent. The second mechanism is theintermetallic compound formation between Cu and GaAs. The thirdmechanism is interstitial diffusion, in which Cu atoms move alongdefects, dislocations, or grain boundaries in GaAs. This third mechanismis of particular importance because during processing, the GaAs surfaceis often damaged. Consequently, there are voids, dislocations, and otherdefects present on the GaAs surface, which facilitate the movement of Cuatoms within the GaAs lattice structure.

Accordingly, the use of Cu typically results in the destruction ornonoperation of GaAs integrated circuits. Further, Cu readily oxidizes,and so is difficult to use as a contact material in GaAs integratedcircuits without any protection. It is therefore necessary to modify theprocess outlined above in order to permit the use of Cu to form themetal layer lining the back side of the wafer and the surface of thevias. Certain aspects of the present invention are directed to novelprocess modifications and techniques which the inventors have developedto overcome at least some of the obstacles in using copper for backsidemetallization of GaAs integrated circuits. A backside metallizationprocess developed for copper will be first described below.

FIG. 6 shows one embodiment of a modified via metallization processrepresented in Block 17 of FIG. 4, which is developed for coppermetallization of a GaAs integrated circuit. FIGS. 7A-7D show examples ofcross sectional diagrams of a section of a GaAs wafer formed inaccordance the process shown in FIG. 6.

In the process 10 of FIG. 6, the via metallization process (block 17)begins with a pre-clean step (block 17 a). FIG. 7A depicts the formedvia 113 processed through the pre-clean step 17 a. In variousimplementations, the pre-clean step removes residues and othercontamination from the via 113 and back surface 103 of the substrate 102and activates the surfaces for subsequent metal adhesion.

Referring to the process 10 of FIG. 6, a metal barrier and seed layercan be formed in the via 113 and on the back surface 103 of thesubstrate 102 in block 17 b. FIG. 7B shows an example of a seed layer109 and a metal barrier layer 104 that can be formed in the via 113 andon the back surface 103 of the substrate 102.

Referring to the process 10 of FIG. 6, a copper layer is formed in thevia 113 and on the back surface 103 of the substrate 32 in block 17 c.FIG. 7C shows an example of a copper contact layer 106 that can beformed in the via 113 and on the back surface 103 of the substrate 102.The copper contact layer 106 can replace some or all of the gold contactlayer that is typically deposited in the via 113 and on the back surface103. As FIG. 6 further shows, in some embodiments, an optional heattreatment step in block 17 d can follow the copper deposition process.

In some implementations of the embodiment shown in FIG. 6, the viametallization process (blocks 17 a-17 d) is followed by street formation(block 18), and deposition of a protective layer deposition (block 18 a)before debonding wafer from carrier.

FIGS. 7A-7D show examples of cross sectional diagrams of a section of aGaAs wafer with a via formed in accordance with embodiments of theprocess 10 in FIG. 3 is illustrated. Section 100 has via 113 extendingthrough a GaAs substrate 102. Referring to the process 10 of FIG. 3, thevia 113 may be pre-cleaned (block 17 a). The via 113 and back side 105of the GaAs wafer 102 may be cleaned using, for example HCl and/or an O₂plasma ash process.

Following cleaning, the via may be barrier layer followed by a seedlayer may be deposited (block 17 b). First a barrier layer 104 isdeposited on the contact side 105 of the GaAs substrate 102. In oneexample, the barrier layer 104 is a nickel vanadium (NiV) layer disposedat about 800 angstroms thickness. The NiV may be deposited using aphysical vapor deposition process (commonly known as sputtering), orother known deposition process. The NiV provides an effective diffusionbarrier between the GaAs substrate and the copper contact layer 106,which will be applied later. Since copper is known to have anundesirable diffusion effect on GaAs, the NiV is deposited in arelatively thick layer. It will be appreciated that the thickness of thelayer may be adjusted according to the needs of the particularapplication. For example, devices subjected to long-term use may requirethicker layers, and the layer may be adjusted according to othermaterial used, for example, in the seed layer 109.

A seed layer 109 may then be deposited on the barrier layer 104.Although the seed layer 109 may not always be necessary, it has beenfound that a seed layer facilitates better mechanical and electricalconnection of the copper contact layer. The metal seed layer may be, forexample, either a copper layer or a gold layer, and may be deposited ata thickness of about 700 angstroms using a physical vapor depositionprocess. If copper is used as the seed layer, then an activation processmay need to be performed at a later time if the copper has been allowedto oxidize.

The via 113 may then be plated with copper (block 17 c). The coppercontact layer 106 is deposited on the seed layer 109, if present. Thecopper contact layer 106 is deposited using an electroplating process.The copper is deposited at a relatively uniform thickness, such as about6 μm. It will be appreciated that other types of processes andthicknesses may be used. Depending on the size of the via 113, thecopper may simply coat the walls, or may nearly fill the via. Tofacilitate faster production, a 6 μm coating of the copper contact layer106 typically provides sufficient electrical conduction, while leaving acentral opening in via 113.

Following the copper plating, the GaAs wafer 102 is subjected to anoptional heat treatment (block 17 d). The metallization process cancontinue for 48 hours or more. Such a long process disadvantageouslyextends production time GaAs integrated circuit devices. Additionally,this slow process results in copper structure with significant defects,cracks, etc caused by the slow growth. Adding heat to the process bothsignificantly accelerates the metallization process and increase thequality and uniformity of the copper grain structure. In typical PECVDprocesses, the heat treatment involves application of temperaturesbetween 200 to 300° C. These temperatures may exceed the melting pointfor the adhesive used to bond the wafer to the carrier. Subjecting GaAswafers mounted onto carriers to such high temperatures may thereforedisadvantageously decrease the bonding strength of the carrier andwafer. Accordingly, in certain embodiments the GaAs device is subjectedto a temperature of approximately 100° C. Once the GaAs has beensubjected to heat treatment, the metallization (block 17) of via 113 iscomplete. In some embodiments, the metallization (block 17) of via 113is complete without heat treatment.

Referring to the process 10 of FIG. 6, the GaAs wafer having a coppercontact layer 106 formed on its back side 105 can undergo a streetformation process (block 18). Such a street is described herein as beingformed from the back side of the wafer and extending through the coppercontact layer 106 to facilitate subsequent singulation of dies. It willbe understood that one or more features described herein can also beimplemented for other street-like features on or near the back surfaceof the wafer. Moreover, other street-like features can be formed forpurposes other than to facilitate the singulation process.

The street can be formed as described above with respect to FIG. 4 andFIGS. 5I-5K. An etch resist layer defining a street opening can beformed using standard photolithography. Next, the exposed street openingin the copper contact layer 106 may be etched using wet etching,although other etching processes are also possible. A pre-etchingcleaning process (e.g., O₂ plasma ash) can be performed prior to theetching process. In various implementations, the thickness of the resistand how such a resist is applied to the back side of the wafer can beimportant considerations to prevent certain undesirable effects, such asvia rings and undesired etching of via rim during the etch process.

After etching the street into copper contact layer 106, the resist layermay be removed, using photoresist strip solvents such as NMP(N-methyl-2-pyrrolidone), applied using, for example, a batch spraytool. To remove residue of the resist material that may remain after thesolvent strip process, a plasma ash (e.g., O₂) and/or aqueous washprocess can be applied to the back side of the wafer.

Following street formation (block 18), a protective layer 108 may bedeposited over the back side of the GaAs wafer (block 18 a). Sincecopper is highly reactive with oxygen, a protective layer 108 isdeposited over the copper contact layer 106. In one example, theprotective layer 108 is an organic solder preservative (OSP). The OSPmay be applied using a bath process, or other known processes may beused. The OSP may be deposited at a thickness of about 700 angstroms. Itwill be appreciated that other thicknesses may be used depending uponapplication specific requirements and the particular materials used. Forexample, thicknesses in the range of about 100 angstroms to about 900angstroms have been found to be effective, although other thicknessesmay be alternatively used.

As described in more detail above, street formation (block 18) may befollowed by debonding the wafer from the carrier (block 19), and testingthe wafer following debonding (block 20). The resulting structure isshown in FIG. 7D.

Direct Die Solder

Current processes for attaching a singulated die to a substrate rely onconductive adhesives such as epoxy. For example, a singulated GaAs diecan be attached to a die attach pad on a printed circuit board (PCB)using epoxy. Due to the tendency of epoxy to spread during theattachment process, the size of the die attach pad on the PCB typicallyexceeds the size of the GaAs die by at least 150 microns in eachdirection.

Direct die solder (DDS) is a process that uses solder to attach asingulated die to a die attach pad, rather than epoxy. DDS is aself-aligned process, such that during reflow solder only wets wherethere is a metal pad underneath. As solder has less tendency to spreadlaterally during this process (e.g., less runaway), the need for a dieattach pad with larger dimensions than the singulated die. Accordingly,using DDS a die attach pad can be used that is identically sized to thesingulated die. This reduced the footprint of the mounted die, therebyfacilitating further module size reduction. FIG. 8 shows a schematicdrawing of a die 802 having a transistor 804 attached to a substrate 806with a solder 808, such as a power amplifier.

FIG. 9A shows a cross-section picture of GaAs die with solder dieattach. After reflow, solder coincide with the edge of the die, wherethe backside metallization ends. Whereas in the epoxy die attach, asshown in FIG. 9B, epoxy runs out during press and there is a typicalrunaway space along the edge of the GaAs die to accommodate the epoxy.Epoxy will also creep up on the sidewalls of the GaAs die. If this“creep-up” is not controlled sometimes epoxy paste can come up to thefront surface of the die and short out bond pads where it attaches.

An additional benefit of using DDS is that solder has higher electricaland thermal conductivity than epoxy. This can be advantageous for highpower applications. In fact, thermal conductivity of solder can be 2-3times higher than that of conductive epoxy. Accordingly, with DDS theheat generated from the transistors can be better dissipated onto theprinted circuit board, resulting on lower operating temperature of thedevices, as shown in FIG. 10. Lower temperature in turn will result inhigher operating efficiency of the devices. FIG. 11 is a comparison ofmeasured thermal resistance. The thermal resistance of solder die attachcan be 25-40% lower than that of epoxy die attach. The thermalresistance of solder die attach can be at least 40% lower than that ofepoxy die attach. Further, DDS can result in high mechanical integrity.

As the die heats up during operation, there is a need to transfer heatfrom the die to the PCB as efficiently as possible. The improved thermalconductivity afforded by solder can therefore improve operation of thedie itself. Further, solder is typically less expensive than epoxy,allowing the manufacturer to achieve reduction in component costs.

However, DDS when applied to certain GaAs dies with NiV barrier and goldfinish presents certain problems of its own. For example, soldertypically reflows at approximately 260° C., depending on the exactcomposition of the solder. During the die attach process, the soldertherefore should be heated at least to this temperature. At such hightemperatures, however, contact metals may dissolve in the solder. Forexample, gold dissolves in solder at these temperatures. Copper likewisedissolves into solder and forms an intermetallic compound, especiallyunder high temperature and high current density conditions. While coppertypically dissolves into solder at a slower rate than gold, theformation of the intermetallic compounds has deleterious effects on dieperformance. The resultant copper intermetallic compounds have five toten times higher resistivity and brittleness. Additionally, over timethe copper can be partially or completely consumed by the solder,resulting in detachment of the copper contact layer from the die,resulting in device failure.

FIG. 12 shows a cross-section of a GaAs device which failedelectrically. As shown, copper inside the via was consumed by solderunder normal operating conditions, resulting in a disconnection of thefront side device from the backside ground plane.

One method of failure of the GaAs device is through the formation ofintermetallic compounds, leading to the consumption of copper as shownin FIG. 12. Traditional surface finishing, such as organic solderpreservative (“OSP”), silver-contained polymer coating, or thin metalflash, can be inadequate to prevent the formation of intermetalliccompounds during direct die solder die attach. Intermetallic compoundformation is mainly temperature dependent. For example, the rateconstant of Sn—Cu IMC's at 135° C. is 40 nm-sec^(1/2). A typical 6 μmbackside copper metallization can be consumed, thus leading toelectrical failure, within hours. OSP or silver-contained polymers willusually not survive the hot solder reflow process.

As noted above, the DDS process poses certain problems, particularly inregards to the interaction of the solder and the backside metal contactmaterial. Accordingly, steps can be taken to protect the backside metalcontact material from being damaged by the solder.

One such process it illustrated in FIG. 13. FIG. 13 is a block diagramrepresenting the direct die attach process according to various aspectsof the present invention, with FIGS. 14A-14C showing examples ofstructures at various stages of the processing sequence of FIG. 14.

With reference to FIG. 14A, the process 70 begins with a copper platedwafer (block 71), a section 400 of which is illustrated. The wafersection 400 includes a GaAs substrate 402, seed layer 404, barrier layer409, and copper contact layer 406. The wafer section 400 with a coppercontact layer can be fabricated as described above with respect to FIGS.6-7D. In some implementations, a pre-clean can be performed on the GaAssubstrate 402 to clean oxides off.

As noted above, a direct copper contact layer may not amenable to use inDDS attachment processes. Referring to FIG. 14B, the copper layer can beprotected from intermixing with solder at elevated temperatures byforming a layer of nickel.

Traditionally, GaAs wafers with backside copper metallization weresputtered with a thin NiV barrier layer, with a sputtered thin goldfinish. This surface finishing is used typically in epoxy die attach toprotect backside copper from oxidation. It offers an adequate oxidationprotection without adding too much to the overall stress and waferwarpage. Initial electrical testing did not reveal any problems when thesame surface finishing was used in solder die attach.

During reliability testing at higher temperature and normal operatingcurrent, however, DDS parts showed increased via resistance. These partsfailed the reliability test prematurely. The failure mode that occurredwas that the parts lost ground connection. Cross-section pictures, suchas shown in FIG. 12 revealed that there was a reaction between backsidecopper and solder in contact with Cu. Intermetallic compounds wereformed such that copper was consumed by solder. Further investigationshowed that this reaction occurs not only on GaAs dies undergoingreliability test but also occurs on GaAs dies right after fabrication.

It is speculated the surface gold acts as a wetting layer such thatduring solder reflow the hot solder creeps up inside the GaAs via,especially the bottom of the via where the sputtered protection layer isat its thinnest. Hot solder penetrates through the protection NiV layerand reacts with the copper to form intermetallic compounds, Cu₆Sn₅ andCu₃Sn. These intermetallic compounds are usually very brittle such thata slight mechanical impact would cause a breakage in the compound. Whena large piece of such a compound falls out from the via, the groundconnection is lost and the GaAs device will fail electrically, as shownin FIG. 12. Even if the via metallization structure is still intact, ifthe entire copper is converted to intermetallic compounds, viaresistance will increase, which in turn will affect the functionality ofthe devices. For example, Cu₃Sn has a resistivity of 8.93 Ωcm and Cu₆Sn₅has a resistivity of 17.1 Ωcm, about 5 to 10 times higher than that ofpure copper, respectively. If the entire copper is converted tointermetallic compounds, via resistance will be about 6 to 10 timeshigher than that of without intermetallic compounds. The formation ofintermetallic compounds inside via will also increase thermal resistancedue to increased thermal resistance of these intermetallic compounds.For example, thermal conductivity of Cu₃Sn is 0.82 W/cmK and thermalconductivity of Cu₆Sn₅ is 0.418 W/cmK, whereas pure copper has a thermalconductivity of 4 W/cmK (or approximately 4 W/cmK), 5 to 10 times higherthan that of the IMC.

Table 1 lists rate constants of Cu—Sn intermetallic compound formationat various temperatures. It can be seen that even at room temperature Cureadily reacts with Sn to form intermetallic compounds. At normaloperating temperature (>135° C.), the formation of intermetalliccompounds is accelerated, in which, the entire copper stack will beconsumed within a week, by estimation. Table 1 also lists the reactionrate between Sn and Ni. It can be seen that Ni also reacts with Sn toform intermetallic compounds, even though at a much slower rate. It isestimated that the NiV barrier layer can be consumed by Sn within hours,due to the reason that it was so thin, especially at the bottom of thevia. Some references also suggested that with a little added Ni in themix, the reaction between Cu and Sn would be accelerated. Once Ni isconsumed, Sn will continue corrode Cu until the entire Cu stack is fullyconsumed, at which point the devices will lose ground connection and theparts will fail. Therefore, a much thicker Ni layer is needed to preventCu—Sn intermixing and intermetallic compound formation inside via.

TABLE 1 Rate constants of Sn—Cu and Sn—Ni intermetallic compoundformation Rate Constants, nm × √sec IMC RT 70° C. 100° C. 135° C. 170°C. Sn—Cu 0.2 1.01 1.22 4.0 6.35 Sn—Ni — 0.238 — — 1.87

Evaporation cannot be used in such an application to deposit thick Nilayer due to its poor step coverage. A thin Ni flash may not be helpfulto prevent intermetallic compound formation, and in some cases canactually enhance formation. Neither is sputter a suitable technique todeposit a thick Ni or NiV layer (in the range of a micron) due tointensive target heating and severe film stress. Therefore, solder cancreep up inside a via to penetrate the thin metal barrier and consumecopper during a die attach process, which can lead to device failure.

Electroless plating is a preferred technique to deposit Ni in thisapplication due to the reason that electroless plating can produce goodstep coverage to deposit sufficient Ni barrier layer at the bottom ofthe via. Electroless plating is also a batch process which can savecycle time. Further information can be found in the article “ElectrolessNickel/Electroless Palladium/Immersion Gold Process for Multi-PurposeAssembly Technology” by Kuldip Johal, Hugh Roberts, and Sven Lamprecht,the entirety of which is hereby incorporated by reference in theirentirety.

Accordingly, in some embodiments, an electroless nickel plating processcan be used (block 72). As a result, a nickel layer 410 can cover thecopper contact layer 106 and provide an effective barrier between thecopper and the solder. The electroless nickel plating process can beused instead of other process, such as thin Ni flash and sputtering.

Electroless nickel plating is an auto-catalytic chemical technique wellknown in the art. It may be used to deposit a layer of nickel 410 overthe copper 406. In some implementations, the copper layer 406 can becatalyzed before electroless nickel plating, which can minimize adhesionof nickel to the copper. In some implementations, the copper wafer canbe submerged into an immersion palladium to catalyze the copper surface.In some embodiments, dimethyl amine borane (DMAB) can be used insteadof, or in conjunction with, palladium to catalyze the copper surface. Insome embodiments, hypophosphite and DMAB can be used as catalyzingagent. In some embodiments, catalyzation of the copper surface usingDMAB can occur from pH 7-12. Further details on DMAB catalyzation isdiscussed in the article “Direct Electroless Nickel Plating on CopperCircuits USING DMAB as a Second Reducing Agent” by Hideto Watanabe andHideo Honma, the entirety of which is hereby incorporated by referencein its entirety. Electroless nickel can then be plated onto the coppersurface at an elevated temperature for a short period of time.

GaAs wafers can be thinned down to 50-150 μm during backside processing,thereby facilitating through wafer etching and heat dissipation duringdevice operation. Thus, because of the thinness, mechanical strength ofa GaAs wafer is much lower than that of a Si wafer. The high stress ofelectrolessly plating nickel may cause wafer warpage, which can lead toproblems in subsequent processing, and can cause wafer cracking andbreakage during subsequent debonding processes. In some embodiments, alow stress nickel bath can be used. The thickness of the nickel layercan be controlled by adjusting the parameters of the electroless platingprocess, as is known in the art. The thickness of the nickel layer 410can be selected to avoid stress on the wafer, which candisadvantageously lead to wafer bow or die crack.

For example, if the nickel layer 410 is too thick, it may impartundesirable stress on the wafer. Subject to too much stress, the wafer400 may bow or crack or warp, thereby making subsequent processing moredifficult, if not impossible. Accordingly, the nickel layer 110 shouldbe sufficiently thick to provide an effective barrier between the copperlayer 406 and the solder during attachment, without being so thick as toresult in wafer bowing or cracking. However, if the nickel layer 410 istoo thin, it may not be able to stop intermetallic compound formation.Because of the more stringent thickness requirements, the metallizationprocess used for under bond metallization in the flip chip industry, orthe thick barrier layers in the printed circuit board manufacturingindustry, may not be used. From a barrier layer purpose, Ni should bethick enough to prevent the intermixing between Sn and Cu andintermetallic compound formation at elevated temperature. As shown inTable 2, keeping the Ni under a certain thickness can minimize the waferwarpage problem and the GaAs dies will pass electrical tests such as viaresistance.

One issue associated with electroless Ni is film stress. A typicalelectroless Ni bath could use sodium hypophosphite as a reducing agent.The incorporation of hydrogen and phosphorus generated in the platingprocess, combined with thermal mismatch between base Cu metal and platedNi barrier layer, may result in tensile stress of the plated Ni film. Asdiscussed above, GaAs wafer is typically thinned before backsidemetallization. Any stress imposed on the film may contribute to waferwarpage, which may not only contribute to difficulties in subsequentprocessing, but also induce wafer breakage and die crack. With thecomplexity of the electroless Ni plating process and mechanicalproperties of Ni metal, the room to optimize the Ni plating process thusto reduce film stress is limited without changing chemistry. Waferwarpage is highly dependable on film thickness. Reducing the Ni filmthickness will also reduce the wafer warpage, as seen in Table 2. Theaddition of Ni in the film stack on the through wafer via does notaffect via resistance significantly. The thicker the Ni is, however, theworse the wafer warpage is. When the Ni film thickness is above a fewmicrons, the wafer becomes significantly warped such that it cannot beprocessed further and may be scrapped.

TABLE 2 Wafer warpage measurements on Ni plated wafers. Circuit CircuitNi Lot# Wafer# up down Thickness Resistance A 1 0.75 mm 3.0 mm Thin <10mΩ 2 0.75 mm 3.0 mm Thin <10 mΩ 3 0.75 mm 3.75 mm Mid <10 mΩ 4 1.0 mm3.75 mm Mid <10 mΩ B 2 1.0 mm 2.0 mm Thin <10 mΩ 3 1.0 mm 2.5 mm Thin<10 mΩ 4 0.75 mm 2.0 mm Mid <10 mΩ 5 1.0 mm 3.75 mm Mid <10 mΩ

Another concern with added electroless Ni in the structure is themagnetism of the Ni metal. Electroless Ni can be non-magnetic if thephosphorus content is high enough. Unfortunately, higher phosphoruscontent in the film will also lead to higher stress of the film.Accordingly, in some embodiments the phosphorus content in the Niplating is in the mid-range such that the Ni film is slightly magnetic.Due to the reason the GaAs power amplifiers are used in the RFapplication, this magnetic property would have adverse effect in thefunctioning of the devices. Expansive electrical testing on both waferlevel and package level was carried out to ensure the added magnetism inthe GaAs device is tolerable. FIG. 15 is an example of one of tests ofthe key parameters of the device, the power out. As shown in the figure,the power out at certain frequencies is probably impacted by themagnetism of the added Ni in the structure. It should be pointed out,however, that the overall difference between solder die attach and epoxydie attach is within a few tenth of a dB and it meets all the publishedelectrical specifications of the device.

FIG. 16 shows a cross-section picture of an electroless Ni plated GaAsdevice after over a thousand of hours of reliability testing with addedelectrical current and at elevated temperature. The Ni is shown intactwithout any sign of corrosion or intermixing by the solder. Cu is wellprotected and is still at its full thickness even after the designedlife time of the device. The electroless Ni plating at the bottom of thethrough wafer via is well beyond the 40% coverage requirement, comparedto the Ni thickness on the field. Another interesting aspect, shown inthe figure, is that the solder wetted inside the entire via. This can bethe benefit of the electroless Pd coating, plated after the Ni plating,to prevent Ni from oxidation, and discussed below. Pd can act as awetting layer for the solder such that the solder coverage inside via isalso improved.

FIG. 17 shows a cross-section of bottom of a through wafer via, whichwas plated with electroless Ni and electroless Pd. The continuouscoverage of Ni inside via is clearly seen. Due to the high aspect ratioof the through wafer via, the bottom of the through wafer via istraditionally a problematic area for barrier layer coverage. If usingsputtering process, for example, the typical coverage is less than 20%compared to the thickness on the field. Electroless Ni, on the otherhand, can provide more than 40% coverage inside a via.

Exposed to atmosphere, nickel will readily oxidize. As shown in FIG.18C, a palladium flash 411 (block 73) can be applied over the nickellayer 410 and the copper layer 406. The palladium flash 411 protects thenickel layer 410 from oxidation.

In some embodiments, an electroless palladium finish can be applied overthe nickel layer 410 which can protect the nickel layer 410 fromoxidation. Palladium can be used over, for example, gold because of itslower cost and excellent solder wettability.

Once the copper layer 406 has been covered with nickel layer 410, whichin turn is coated with palladium flash 411, the wafer can proceed asdescribed above with respect to FIGS. 4-5R.

FIG. 18A illustrates a GaAs wafer 500 with a plurality of individualintegrated circuits 551 formed in accordance with embodiments of theinvention shown and described above with reference to FIGS. 6, 7A-7D,13, and 14A-14C in which copper is used as a contact metal for the viasand back-side plane. As shown in FIG. 18A, streets 552 have been formedin the regions between each integrated circuit 551 on the wafer 550. Asdescribed above, street formation involves removing copper in theregions between the integrated circuits.

Following street formation, the wafer 550 is placed onto cutting tape553, with the backside of the GaAs wafer 550 adhering to the cuttingtape 553 and frame in the manner shown in FIGS. 18B and 18C. Next, theintegrated circuit dies are singulated by cutting through the GaAs waferalong the pre-formed streets. A scribe may be applied to the streets inorder to mechanically singulate the integrated circuit dies.Alternatively, a laser may be used to burn through the streets.Mechanical scribing is inexpensive, but typically less accurate thanlaser singulation, and may cause damage to the die. Laser singulation ismore accurate and reduces damage, but at increased expense.

Once the integrated circuit dies have been singulated, the cutting tapeis stretched apart. This stretching ensures that the dies have beensingulated, as it results in widening the separation between each of thedies. The cutting tape may be stretched until the tape is visiblebetween each of the dies. FIG. 18C illustrates stretched cutting tape inwhich some of the singulated dies have been removed. The dies may beremoved from the cutting tape manually or by automated robotics. Forexample, an automated die-picking machine may select and removeindividual dies through the use of vacuum pressure. FIG. 18D illustratesa singulated GaAs integrated circuit die, according to an embodiment ofthe present invention.

Once individual GaAs integrated circuit dies have been formed, they maybe packaged for incorporation into larger electronic devices. Varioustypes of packaging exist, some of which are described in more detailbelow. It will be understood that there exist myriad different types ofpackaging beyond those listed and described herein. Depending on thedesired application, virtually any type of packaging may be used inaccordance with the present invention. Four different packages aredescribed in more detail below: ball grid array (BGA), land grid array(LGA), molded leadframe, and quad-flat no-leads (QFN).

FIG. 19 shows an example shows an example sequence of BGA packaging ofsingulated GaAs integrated circuit dies, according to one embodiment,with FIGS. 20A-20H showing examples of structures at various stages ofthe processing sequence of FIG. 19. With reference to FIG. 20A,individual dies 551 are arranged (block 501), typically in an array,onto a laminate packaging substrate 555. A single packaging substrate555 such as that shown in FIG. 20A can include between 200 to 400 dies551, although the specific number may vary depending on the application.The packaging substrate 555 includes pre-formed lower contact pads 554on its lower surface. As described in more detail below, a grid ofsolder balls 556 are formed on the lower contact pads 554. On the topsurface the packaging substrate has die attach pads 557, onto whichsingulated dies 551 are mounted, and a plurality upper contact pads 558.The singulated dies 551 are preferably soldered to the die attach pads556. As illustrated, the die attach pads 557 have a footprintsubstantially identical to that of the singulated dies 551. Thepackaging substrate includes internal interconnections to electricallyconnect the upper contact pads 558 on the top surface to the lowercontact pads 554 on the bottom surface.

The die attach pad 557 is typically flat and made of tin-lead, silver,or gold-plated copper. With reference to FIGS. 20B and 20C, theindividual dies 201 are attached to the die attach pads 207 (block 502)by applying solder paste to all die attach pads 557. Solder paste is anadhesive mixture of flux and tiny solder particles. The solder paste maybe deposited by the use of a screen printing process, or byjet-printing. After the solder paste has been applied, individual diesare placed onto the packaging substrate 555 by robotic pick-and-placemachines. Individual dies 551 may be removed from the cutting tape andtransferred directly to the packaging substrate, where they arepositioned to align the die attach pads with the contacts of theindividual dies. The solder paste connects the die attach pads 557 tothe contacts of the individual dies 551. To provide a more robustconnection, the dies are subjected to heat treatment for solder reflow.The precise temperatures and times for this process will vary dependingon the composition of the solder paste. Typical temperatures range from100° to 260° C., with dwell times at peak temperatures ranging from 50seconds to two minutes. This heat treatment causes the solder particleswithin the solder paste to melt. The solder is then allowed to cool,resulting in a robust electrical and mechanical connection between thepackaging substrate and the individual dies.

With reference to FIG. 20D, following attachment of the individual dies551 to the packaging substrate 555, electrical interconnection is formedbetween bonding pads on the integrated circuit and the upper contactpads 558 on the top surface of the packaging substrate 555 (block 503).This connection may be formed by wire bonding or flip-chip methods. Wirebonding involves arranging wires 559, often made of copper, gold, oraluminum, between an upper contact pad 558 at one end, and a bonding padon the integrated circuit die 551 at the other. The wire 559 is attachedusing some combination of heat, pressure, and ultrasonic energy to weldthe wire 559 in place. Flip chip interconnection involves applyingsolder bumps to the bonding pads on the top surface of the integratedcircuit. The integrated circuit is then inverted, and arranged such thatthe solder bumps align with contact pads. With the application of heat,the solder bumps melt and, following a cooling process, an electricaland mechanical connection may be formed between the bonding pads on theintegrated circuit die and the contact pads on the packaging substrate.

With reference to FIG. 20E, after electrical interconnection has beenformed between the die and the packaging substrate, the entire packagingsubstrate is covered with a molding compound 560 (block 504). There area wide variety of commercially available molding compounds. Typically,these are epoxy-based compounds. The packaging substrate 555 coveredwith the molding compound 560 is then cured in an oven. The temperatureand duration of curing depends on the particular molding compoundselected. As shown in FIG. 20F, after the molding compound 560 hascured, the each die 551 on the packaging substrate 560 is totallyencapsulated, including the electrical interconnections 559, with onlythe bottom surface of the packaging substrate 555, with its lowercontact pads, exposed. At this stage, the packaging substrate 555covered with cured molding compound 560 can be sawed (block 505),thereby singulating the packaged devices. Singulation may be performedmechanically, such as with a wafer saw.

Each packaged device is inverted at this stage, and then on top of eachlower contact pad 554 on the packaging substrate, a small ball of solderpaste is deposited, creating a grid of solder paste balls 556 (block506). The BGA package may then be placed over solder pads on a PCB, witheach solder paste ball 556 aligned to a solder pad. The solder pads areflat, and typically made of tin-lead, silver, or gold-plated copper.FIG. 20E illustrates a schematic cross-section of a singulated BGApackaged die, with FIGS. 20G and 20H illustrating the top and bottomperspective views of the same.

FIG. 21 shows an example shows an example sequence of LGA packaging ofsingulated GaAs integrated circuit dies, with FIGS. 22A-22G showingexamples of structures at various stages of the processing sequence ofFIG. 21. In many respects, LGA packaging is similar to BGA packaging. Asshown in FIG. 22A, individual dies 551 are arranged (block 401),typically in an array, onto a laminate packaging substrate 555. Thepackaging substrate 555 includes pre-formed lower contact pads 554 onits lower surface. On the top surface the packaging substrate has dieattach pads 557, onto which singulated dies 551 are mounted, and aplurality upper contact pads 558. As illustrated, by using the DDSprocess discussed above, the die attach pads 557 may have a footprintsubstantially identical to that of the singulated dies 551. Thepackaging substrate includes internal interconnections to electricallyconnect the upper contact pads 558 on the top surface to the lowercontact pads 554 on the bottom surface.

The die attach pad 557 is typically flat and made of tin-lead, silver,or gold-plated copper. With reference to FIGS. 22B and 22C, theindividual dies 551 are attached to the die attach pads 557 (block 402)by applying solder paste to all die attach pads 557, similar to BGApackaging. After the solder paste has been applied, individual dies areplaced onto the packaging substrate 555 by robotic pick-and-placemachines. The solder paste connects the die attach pads 557 to thecontacts of the individual dies 551. To provide a more robustconnection, the dies are subjected to heat treatment for solder reflow,as described in more detail above.

With reference to FIG. 22D, following attachment of the individual dies551 to the packaging substrate 555, electrical interconnection is formedbetween bonding pads on the integrated circuit and the upper contactpads 558 on the top surface of the packaging substrate 555 (block 403).This connection may be formed by wire bonding or flip-chip methods, asdescribed with respect to BGA packaging above.

With reference to FIG. 22E, after electrical interconnection has beenformed between the die and the packaging substrate, the entire packagingsubstrate is covered with a molding compound 560 (block 404). Thepackaging substrate 555 covered with the molding compound 560 is thencured in an oven. As shown in FIG. 22F, after the molding compound 560has cured, the each die 551 on the packaging substrate 560 is totallyencapsulated, including the electrical interconnections 559, with onlythe bottom surface of the packaging substrate 555, with its lowercontact pads, exposed. At this stage, the packaging substrate 555covered with cured molding compound 560 can be sawed (block 405),thereby singulating the packaged devices.

It is at this stage that LGA packaging deviates from BGA packagingdescribed above. In contrast to BGA, LGA does not involve placing smallballs of solder paste onto the packaging substrate. Rather, the solderpaste, or alternatively molten solder, is placed onto the PCB over thesolder pads, and then the LGA packaged device is arranged such that thecontact pads 554 are aligned over the solder pads (block 406). Formounting onto a PCB, the package may be placed over corresponding solderpads on the PCB, followed by heat treatment to induce solder reflow. ThePCB is outfitted with pre-formed conductive solder pads, also known asPCB pads, arranged to correspond to contact pads 554 of the packagingsubstrate. In short, BGA involves applying solder paste to the packagingsubstrate 555, whereas LGA involves applying solder paste to the PCB.FIG. 22E illustrates a schematic cross-section of a singulated BGApackaged die, with FIG. 22G illustrating a bottom perspective view ofthe same

After placement of the packaged device on the packaging substrate, BGAand LGA proceed similarly. The packaged device mounted onto a PCB issubjected to a heat treatment for solder reflow, followed by a cool downperiod.

FIG. 23 shows an example shows an example sequence of leadframepackaging of singulated GaAs integrated circuit dies, with FIGS. 24A-24Dshowing examples of structures at various stages of the processingsequence of FIG. 23. With reference to FIG. 24A, individual singulatedintegrated circuit dies 551 are mounted onto a metallic leadframe 561(block 601). The leadframe 561 includes a plurality of die attachregions 562, and a plurality of leads 562. The leadframe 561 istypically made of a thin sheet of copper or copper alloy. In someinstances, the copper is plated with another metal, such as pure tin,silver, nickel, gold, or palladium. For high-throughput, the processingmay be performed in batches, in which an array or strip of connectedleadframes is provided.

The singulated dies 551 can be mounted onto the die attach regions 552of the leadframe 561 by an adhesive or soldering process (block 601).The bond is typically formed between the backside metallization of thedie and the metal surface of the leadframe. The bond can be formed usingsolder paste followed by a reflow process, as described above.Alternatively, molten solder can be placed directly onto the die attachpad, followed by placement of the die. Conductive epoxy adhesives mayalso be used in place of solder.

With reference to FIG. 24B, After the die has been attached to theleadframe, wire bonding is then used to form electrical connections 566between the die attach pads to the package leads (block 602). Next, amechanical trimming operation separates the leads 563 from the diebonding platform on the lead frame 561 (block 603). Plastic or othermolding compound 565 is then injection molded around the die 551 andleadframe 551 to form the typical black plastic body (block 604),similar to the molding processes described above with respect to LGA andBGA packaging. In typical leadframe packaging, however, the frame forinjection molding is designed such that a portion of the leads 563remains uncovered by the molding compound 565. Following curing, thepackaged device is presented with a portion of the leads 563 extendingout from the cured molding compound, typically a black plastic. FIG. 24Cillustrates a schematic cross-section of a singulated leadframe packageddie, with FIG. 24D illustrating a top perspective view of the same

The sequence illustrated in FIG. 23 can also be applied to quad-flat nolead (QFN) packaging of singulated GaAs integrated circuit dies. FIGS.25A-25E show examples of structures at various stages of the processingsequence. QFN packaging is similar to leadframe packaging, with someimportant distinctions. With reference to FIG. 25A, QFN packaging alsobegins with a leadframe 561 comprising die attach regions 562 and aplurality of leads 563. Singulated dies 551 are attached to theleadframe 301 in a manner similar to that described above with respectto standard leadframe packaging (block 701). As shown in FIG. 25B, Wirebonding then follows, as described above, to connect the die 551 to theleadframe leads 563 with wires 566 (block 702). With QFN packaging,however, the leads 563 are not designed to extend out beyond the curedmolding materials after singulation. Accordingly, there is no need forsingulation prior to injection molding of the molding compound over theleadframe and die. Instead, a batch of connected mounted dies 551 can becovered with a molding compound, followed by a curing process (block703).

Once the molding compound 565 has cured, the leadframes with mounteddies are singulated (block 704). Typically a diamond saw is used to cutthrough the hardened cured molding compound 565. As the diamond saw cutsthrough the leads 563, each side of the QFN package has exposed portionsof the leadframe 561. Unlike traditional leadframe packaging, however,the exposed portions are flush with the molding compound 565. The leads563 are also typically exposed on the lower surface of the QFN package.FIG. 25C illustrates a schematic cross-section of a singulated QFNpackaged die, with FIGS. 25D and 25E illustrating top bottom andperspective views of the same.

Mounted Integrated Circuit Device

FIG. 26 illustrates one embodiment of a GaAs integrated circuit device200. The device 200 generally comprises a printed circuit board 212connected to a GaAs integrated circuit 211. The GaAs integrated circuit211 has a backside 105 and a frontside 103. The GaAs integrated circuit211 includes a GaAs substrate 102, a barrier layer 104, a protectivelayer 108, and a copper contact layer 106. In some embodiments, the GaAsintegrated circuit 211 may also include a seed layer 109 between thecopper contact layer 106 and the barrier 104. The seed layer 109 mayserve to facilitate mechanical and electrical connection to the coppercontact layer 106, but is not always necessary. The printed circuitboard includes a pad which is adapted to couple with the GaAs integratedcircuit 211 at the backside 105. The GaAs integrated circuit 211 isconfigured to be mounted on the printed circuit board 212 by the pad216. In one embodiment, the GaAs integrated circuit 211 is mounted tothe pad 216 by a layer of solder 218 interposed between the backside 105and the pad 216.

The barrier layer 104 is formed on the lower surface 105 of the GaAssubstrate 102 and serves to isolate the copper contact layer 106 fromthe GaAs substrate 102 to prevent copper diffusion. The copper contactlayer 106 is formed on the backside 105 of the GaAs integrated circuit211. The copper contact layer 106 provides an electrical ground contactbetween the GaAs substrate 102 and the pad 216 on the printed circuitboard 212. In one embodiment, the layer of solder 218 is formed betweenthe copper contact layer 106 and the pad 216 to securely mechanicallyattach the backside 105 of the GaAs integrated circuit 211 to theprinted circuit board 212. In one embodiment, the protective layer 108is formed between the copper contact layer 106 and the solder 218 toprevent oxidation of the copper. The GaAs substrate 102 comprises aplurality of vias 25 which have been etched through the GaAs substrate102 to form electrical connections between various integrated circuitsdisposed thereon. The vias 25 have sidewalls which will comprise thelayers previously deposited on the GaAs substrate, as described in moredetail above.

FIG. 27 illustrates a portion of an electronic device incorporating aGaAs integrated circuit device made according to various methods of thepresent invention. In some embodiments, the device can be a portablewireless device, such as a cellular phone. The device can include abattery configured to supply power to the device, a circuit boardconfigured to provide support for and to interconnect various electroniccomponents, and an antenna configured to receive and transmit wirelesssignals. The electronic device can include a number of additionalcomponents, such as a display processor, central processor, userinterface processor, memory, etc. In other embodiments, the electronicdevice may be a component of a tablet computer, PDA, or other wirelessdevice.

Terminology

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While certain embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. An electronic circuit device comprising: asubstrate; a die attach pad located on the substrate; a GaAs integratedcircuit die having a copper backside contact pad and having a footprintof approximately the same size as the die attach pad, the GaAsintegrated circuit die being connected to the die attach pad by a solderlayer, the solder layer being disposed between the copper backsidecontact pad and the die attach pad on the substrate in a manner suchthat the GaAs integrated circuit die self-aligns with the die attach padafter reflow of the solder layer; and a barrier layer formed from nickeland a palladium flash layer, said barrier layer being disposed betweensaid copper backside contact pad and said solder layer.
 2. Theelectronic circuit device of claim 1 wherein said substrate is a printedcircuit board.
 3. The electronic circuit device of claim 1 whereinthermal resistance of the solder layer is at least 40% lower thanthermal resistance of an epoxy layer.
 4. The electronic circuit deviceof claim 1 wherein the copper backside contact pad has a thermalconductivity of approximately 4 W/cmK.
 5. A GaAs integrated circuitincorporating the electronic circuit device of claim
 1. 6. A method formanufacturing a GaAs wafer assembly, said method comprising: fabricatinga GaAs wafer having a copper layer over a backside of the wafer;electroless plating a barrier layer over said copper layer; forming apalladium flash layer over the copper layer; forming at least onesingulated die from said GaAs wafer; and direct die soldering said atleast one singulated die to a die attach pad on a substrate such that asolder layer is formed between the at least one singulated die and thedie attach pad, the soldering performed in a manner such that the atleast one singulated die self-aligns with the die attach pad afterreflow of the solder layer.
 7. The method of claim 6 wherein saidsubstrate is a printed circuit board.
 8. The method of claim 6 wherein asurface area of said singulated die is substantially equivalent to asurface area of said die attach pad.
 9. A GaAs integrated circuit madein accordance with the method of claim
 6. 10. The GaAs integratedcircuit of claim 9 wherein said GaAs integrated circuit comprises athrough-wafer via at least partially filled with copper.
 11. The GaAsintegrated circuit of claim 10 wherein the electroless plating coversmore than 40% of the through-wafer via.
 12. An electronic circuit modulecomprising: a singulated GaAs integrated circuit die having a coppercontact pad; a printed circuit board having a die attach pad, said dieattach pad sized to receive the singulated GaAs integrated circuit dieand having a footprint of approximately the same size as the singulatedGaAs integrated circuit die; a solder layer disposed between said coppercontact pad of the die and said die attach pad of the printed circuitboard, said copper contact pad of the singulated GaAs integrated circuitdie attached to said die attach pad of the printed circuit board in amanner such that the singulated GaAs integrated circuit die self-alignswith the die attach pad after reflow of the solder layer; a nickellayer, said nickel layer formed between said copper contact pad and saidsolder layer; and a flash palladium layer, said flash palladium layerformed between said nickel layer and said copper contact pad andconfigured to act as a wetting layer for the solder layer.
 13. Theelectronic circuit module of claim 12 wherein the size of said dieattach pad does not exceed the size of said singulated GaAs integratedcircuit die by more than 150 microns in at least one direction.
 14. Theelectronic circuit module of claim 12 wherein said singulated GaAsintegrated circuit die is a radio frequency integrated circuit die.